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Process Evaluation for Lead-free Reflow Soldering Equipment Configuration
Author(s): 
Pages: 337-341,366
Year: Issue:  6
Journal: Electronics Process Technology

Keyword:  Reflow solderingFree-lead assemblyForced-Air ConvectionN2 ProtectionFlux management;
Abstract: Higher melting point and poor wettability of free-lead solder challenge the traditional reflow soldering equipments. Taking into account of practical soldering process, analyze and illustrate the demands of reflow soldering equipments in five aspects:heating system, process control system, flux management system, cooling system and N2 protection.
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