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Research on Reflow Process of SMT/THT Mix-assembly
Author(s): 
Pages: 359-362,370
Year: Issue:  6
Journal: Electronics Process Technology

Keyword:  Through-hole componentsStencil DesignMixed Reflow Soldering;
Abstract: High density and mixed-mounting printed circuit boards, which contain lots of surface mount devices and a few of through hole components, is the main type of electronic assembly category. Traditional reflow soldering couldn’t finish mounting SMT/THT mixed PCBs in one process. Otherwise, wave soldering or hand soldering may add extra processes and induce wrapping to PCBs. These problems could be resolved using SMT/THT mixed reflow soldering process. In this process, firstly, all of SMCs and THCs are pre-prepared, then designed reasonable solder printing stencil for THCs, finally adopted SMT/THT mixed reflow soldering process. The mixed-mounting PCBs were completed, the quality of soldering joints are up to demands.
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