The server is under maintenance between 08:00 to 12:00 (GMT+08:00), and please visit later.
We apologize for any inconvenience caused
Login  | Sign Up  |  Oriprobe Inc. Feed
China/Asia On Demand
Journal Articles
Bookmark and Share
Research on Reflow Process of SMT/THT Mix-assembly
Pages: 359-362,370
Year: Issue:  6
Journal: Electronics Process Technology

Keyword:  Through-hole componentsStencil DesignMixed Reflow Soldering;
Abstract: High density and mixed-mounting printed circuit boards, which contain lots of surface mount devices and a few of through hole components, is the main type of electronic assembly category. Traditional reflow soldering couldn’t finish mounting SMT/THT mixed PCBs in one process. Otherwise, wave soldering or hand soldering may add extra processes and induce wrapping to PCBs. These problems could be resolved using SMT/THT mixed reflow soldering process. In this process, firstly, all of SMCs and THCs are pre-prepared, then designed reasonable solder printing stencil for THCs, finally adopted SMT/THT mixed reflow soldering process. The mixed-mounting PCBs were completed, the quality of soldering joints are up to demands.
Related Articles
No related articles found