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Research on Influence Factors of Micro Through-hole Filling Copper Plating
Author(s): 
Pages: 349-351,376
Year: Issue:  6
Journal: Electronics Process Technology

Keyword:  Printed Circuit BoardThrough-hole Filling Copper PlatingMicro Through-hole;
Abstract: Because of the strong requirements of high-precision, high-reliability and low-cost Printed Circuit Boards(PCB), the conventional conformal through-hole plating already cannot satisfy the requirements of high-density wiring, so put forward the micro through-hole plating copper filling and micro blind hole filling copper plating technology. Additives of factors that affect micro through-hole plating copper filling were analyzed, and using the orthogonal experiment research methods, obtained the optimal combination and proportion of additives, so that micro through-hole plating copper filling is well acquired.
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