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amsd zai shu mo hun he xin pian she ji zhong de ying yong
Author(s): 
Pages: 60-61
Year: Issue:  8
Journal: Electronic Products China

Keyword:  数模混合仿真芯片设计设计流程模拟仿真器模拟电路混合信号工艺技术集成前端电路开发周期;
Abstract: <正>随着半导体工艺技术的发展,SOC芯片不仅集成了大量的数字处理电路,同时也集成了大量的模拟电路,甚至还集成了射频前端电路。因此,仿真与验证已成为SOC芯片设计流程中的关键环节,约占整个芯片开发周期的50%~80%。如何缩短仿真验证时间也成为SOC设计者和EDA厂商共同面临的难题。许多EDA厂商都各自开发了相应的混合仿真平
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