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liang kuan chao ji feng zhuang she ji shi yong yu da xing ban dao ti xin pian ju bei ye jie biao zhun feng zhuang mian ji he yin xian jian ju er rong na geng da ban dao ti xin pian
Pages: 29
Year: Issue:  3
Journal: Electronic Products China

Keyword:  封装设计半导体芯片线间距功率半导体硅含量额定电流内标准汽车应用表面贴装子空间;
Abstract: <正> 国际整流器公司两款创新的功率半导体封装设计,Super-220及Super-D2Pak,具备业界标准的封装面积和引线间距(lead spacing),却可容纳体积更大的半导体芯片,承受更高的电流。 Super-220封装与TO-220封装具有相同的面积,但硅含量却高出两倍多(相当于业界标准的TO-247封
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