Tunable Reactive Wetting of Sn on Microporous Cu Layer
Author(s): Qingquan Lai, Lei Zhang, Cai Chen and J.K. Shang Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
Pages: 379-384
Year: 2012 Issue: 4
Journal: Journal of Materials Science & Technology
Keyword: Wetting; Porous material; Soldering;
Abstract: Wetting of microporous Cu layer by liquid Sn resulted in contact angles from 0 to 33 deg., tunable by varying wetting temperature and porous microstructure. The wetting was dominated by the interfacial metallurgical reaction, which can lead to pore closure phenomenon, as the liquid infiltration facilitating the wetting process.
Pages: 379-384
Year: 2012 Issue: 4
Journal: Journal of Materials Science & Technology
Keyword: Wetting; Porous material; Soldering;
Abstract: Wetting of microporous Cu layer by liquid Sn resulted in contact angles from 0 to 33 deg., tunable by varying wetting temperature and porous microstructure. The wetting was dominated by the interfacial metallurgical reaction, which can lead to pore closure phenomenon, as the liquid infiltration facilitating the wetting process.
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