The server is under maintenance between 08:00 to 12:00 (GMT+08:00), and please visit later.
We apologize for any inconvenience caused
Login  | Sign Up  |  Oriprobe Inc. Feed
China/Asia On Demand
Journal Articles
Laws/Policies/Regulations
Companies/Products
xin pin chu chuang
Pages: 62+64+66
Year: Issue:  11
Journal: EDN China

Keyword:  芯片级封装电话线路板传真系统使用环氧树脂转换器数字式编号公司;
Abstract: <正> 采用CSP封装的CPLDXilinx公司的XC9536型CPLD器件首次采用芯片级封装CSP,其体积比裸芯片大20%。XC9536的球间距(ballPitch)为0.8mm,球阵列(ball array)为7×7mm。这种18脚CSP封装的面积只有44脚VTQFP面积的1/3,比48脚TQFP封装面积小40%。电话:(852)2424-5200
Related Articles
loading...