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li yong e xie dian zi neng pu que ding au-cu xi tong de hu kuo san xi shu ji jing jie kuo san xi shu
Author(s): 
Pages: 155-158
Year: Issue:  3
Journal: Vacuum Science and Technology

Keyword:  浓度剖面互扩散系数俄歇电子能谱计算结果电子束能量梯度法热处理平坦区上升法晶界;
Abstract: In this paper the concentration profiles of copper in the gold thin film of the Au-Cu system after the heat treatment of different time-intervals have been measured by Auger electron spectroscopy (PHI 550). Based on the profiles of copper concentrations and Hall's formulae the interdiffusion coefficients of the Au-Cu system have been calculated by two methods, i. e., the "center gradient method" and the "plateau rise method", and the coefficients of grain boundary diffusion have been estimated as well. Discussions about the results have also been given in this paper.
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