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li yong e xie dian zi neng pu que ding au-cu xi tong de hu kuo san xi shu ji jing jie kuo san xi shu
Author(s): Liu Youying, Liu Baoying Li Wang, Zhan Zhenzong Wei Baoan
Pages: 155-
158
Year: 1990
Issue:
3
Journal: Vacuum Science and Technology
Keyword: 浓度剖面; 互扩散系数; 俄歇电子能谱; 计算结果; 电子束能量; 梯度法; 热处理; 平坦区; 上升法; 晶界;
Abstract: In this paper the concentration profiles of copper in the gold thin film of the Au-Cu system after the heat treatment of different time-intervals have been measured by Auger electron spectroscopy (PHI 550). Based on the profiles of copper concentrations and Hall's formulae the interdiffusion coefficients of the Au-Cu system have been calculated by two methods, i. e., the "center gradient method" and the "plateau rise method", and the coefficients of grain boundary diffusion have been estimated as well. Discussions about the results have also been given in this paper.
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