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dian ji da jing li pb mo de yan jiu
Author(s): 
Pages: 254-258
Year: Issue:  4
Journal: Vacuum Science and Technology

Keyword:  大晶粒晶粒生长温度升高平均晶粒尺寸堆积密度增大不同温度基片温度取向度液相;
Abstract: <正> 一、引言作为集成电路和太阳能电池电极引线的金属化薄膜必须具有较好的抗电迁移性能,使金属/半导体界面保持较低的接触电阻和较好的接触稳定性。减弱迁移的途径之一是增大薄膜晶粒尺寸和取向度,减少晶界短路通道,并减弱原子在晶粒内平行密排面方向
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