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Microstructure of Si3N4/Si3N4 joint brazed with (CuZn)85Ti15 filling alloy
Author(s): 
Pages: 263-265
Year: Issue:  3
Journal: MATERIALS SCIENCE AND TECHNOLOGY

Keyword:  Si3N4陶瓷钎焊界面微观结构;
Abstract: 采用(CuZn)85Ti15钎料,研究了Si3N4陶瓷活性钎焊的接头微观组织结构.结果表明:在合适的钎焊条件下可以获得致密的Si3N4/Si3N4接头;钎缝主要由含有Ti的硅化物和Ti的氮化物的Cu固溶体和Cu2TiZn组成;随着焊接温度从850℃升高,界面反应层增厚,填充金属中反应物的数量增多,尺寸增大;Zn能降低钎焊合金的熔化温度并降低钎焊温度,这有利于钎料的流动和润湿钎缝;Zn的蒸发将随着钎焊温度的上升而加剧,但它可以被合适的钎焊过程所控制.
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