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Cellular Spacing Selection of Cu-Mn Alloy under Ultrahigh Temperature Gradient and Rapid Solidification Condition
Author(s): 
Pages: 84-86
Year: Issue:  1
Journal: JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY

Abstract: Cellular spacing selection of Cu-27.3 wt pct Mn alloy has been investigated by laser surface rapid resolidification experiments. The experimental results show that there exists a wide distribution range in cellular spacing under ultra-high temperature gradient and rapid solidification conditions and the average spacing decrease with increase of the growth rate. The experimental results are compared with the current KGT model for rapid cellular/dendritic growth, and a reasonable agreement is found.
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