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Behavior of polyethylene glycol and block copolymer L64 in microvia filling by copper electroplating
Author(s): 
Pages: 15-19
Year: Issue:  11
Journal: Electroplating & Finishing

Keyword:  盲孔填充电镀铜循环伏安溶出聚乙二醇嵌段聚醚氯离子对流;
Abstract: 以聚乙二醇(PEG)和嵌段聚合物L64为主要研究对象,通过金相显微照片和循环伏安溶出法(CVS)研究了镀液中Cl-浓度对填孔镀铜的影响.研究发现,PEG对铜离子沉积的抑制作用受强迫对流与Cl-浓度的影响,对流越强,PEG的抑制作用越强;在30~180mg/L范围内,随着Cl-离子浓度的增加,填孔率呈先增大后减小的趋势,而且Cl-浓度越高,PEG的抑制作用越弱.L64对铜离子沉积的抑制作用不受对流强度及Cl-离子浓度的影响,在20~120mg/L内,填孔率随着Cl-离子浓度的增加呈现缓慢下降的趋势.在其他条件相同的情况下,L64对铜离子沉积的抑制作用远大于PEG.在提高镀液填孔效果方面,L64比PEG有更优秀的表现.
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