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The Interface Microstructure of Ti-Ag-Cu Soldered AlN Ceramics
Author(s): 
Pages: 24-27
Year: Issue:  4
Journal: Vacuum Electronics

Keyword:  AlN陶瓷Ti-Ag-Cu活性法微观结构;
Abstract: 对氮化铝陶瓷Ti-Ag-Cu活性法焊接界面的微观结构进行了研究,对比了涂TiH2后用Ag-Cu焊接和直接用Ti-Ag-Cu合金箔焊接两种方法的焊接界面的微观结构.
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