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Influence of Heat Treatment Temperature on the Ceramic-Metal Sealing Performance
Author(s): 
Pages: 16-20
Year: Issue:  4
Journal: Vacuum Electronics

Keyword:  热处理温度陶瓷金属焊料;
Abstract: 通过对陶瓷电镀件进行不同温度的热处理后,分别用Cu、Ag和AgCu28焊料与可伐和无氧铜封接.随着热处理温度的提高,发现某些封接件的封接强度及封接界面的显微结构发生了改变.综合各种因素后提出热处理温度不能超过850℃.
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