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Defects of Ceramic Metallization——Discussion on no Adhesive Ceramics
Author(s): 
Pages: 28-33
Year: Issue:  4
Journal: Vacuum Electronics

Keyword:  金属化活化铝锰法光板显微结构;
Abstract: 采用金相、扫描电镜、能谱等分析手段,对陶瓷-金属封接的严重缺陷——瓷件“光板”的产生原因进行了分析、探讨,并提出防止光板缺陷的措施.结果表明:焊料向金属化层的严重渗透以及金属化层玻璃相的缺少,均是导致光板的主要原因.通过改进金属化工艺,保证致密的金属化层显微结构,防止焊料渗透,可以避免光板缺陷.
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