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Effect of Cooling Rate on Solder Joint Quality In Lead-free Reflow Soldering
Author(s): 
Pages: 121-126
Year: Issue:  2
Journal: Electronics Process Technology

Keyword:  Cooling RateLead-free Reflow SolderingIntermetallic Compound (IMC)Solder Joint QualityStrain Rate;
Abstract: 无铅再流焊中冷却速率影响焊点力学性能及可靠性。快速冷却可以细化组织,间接控制金属间化合物厚度和形态,影响焊点断裂模式,提高焊点综合性能。但是由于元件与PCB等材料的热不匹配性而造成的较大应力,易造成元件或焊点失效等。通过对文献中研究结果的总结,设计了炉冷、空冷和水冷等几种再流焊冷却方式,并对焊点进行了强度测试和组织成分分析,建议工业用最佳冷却斜率控制在3℃/s~6℃/s。
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