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Analysis of Orthogonal Test for Thermo-sonic Wedge Bonding on LTCC Circuit Board
Author(s): 
Pages: 99-101
Year: Issue:  2
Journal: Electronics Process Technology

Keyword:  Orthogonal testGold wireThermo-sonic wedge bonding;
Abstract: 进行了LTCC基板上金丝热超声楔焊的正交试验,在热台温度和劈刀安装长度等条件不变的情况下,分别设置第一键合点和第二键合点的超声功率、超声时间和键合力三因素水平,试验结果表明第一点超声功率和第二点超声时间对键合强度影响明显。
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