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Lead-free BGA Rework Process
Author(s): 
Pages: 86-89
Year: Issue:  2
Journal: Electronics Process Technology

Keyword:  SMTReflow soldering profileRework technology;
Abstract: 总结了无铅BGA返修的工艺特点、技术要求和温度曲线设置方法;介绍了一种暗红外返修系统的结构与性能特点;结合实际工作详细描述了某航天产品无铅BGA返修的实施工艺,重点阐述了返修时高可靠性的实现方法;从而验证了基于此设备的工艺方法对于无铅BGA返修的有效性。
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