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ipc technet ji shu lun tan guan yu yuan qi jian pai bu wen ju de tao lun
Pages: I0016-I0017
Year: Issue:  2
Journal: Electronics Process Technology

Keyword:  技术论坛IPC元器件排布图形标准表面贴装公差控制PcB;
Abstract: Jian问: IPC技术论坛成员,你们好! 我想咨询各位以下几个问题:IPC-7351《表面贴装设计及焊盘图形标准通用要求》中为PcB三种不同的元器件密度(A级为最宽松、B级为适中、C级为最紧凑)规定了一个相应的“院子余量”(注:为组装测试维修返工之需预留的空置区域)。同时IPC-7351第一页注3解释:
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