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Study on Ethylene Glycol Ether Free Flux and Solder Paste
Author(s): 
Pages: 71-74,105
Year: Issue:  2
Journal: Electronics Process Technology

Keyword:  SnO.3AgO.7Cu solder pasteSoldering performanceSpreading ratioStorage stability;
Abstract: 研究了多元醇类溶剂及其复配物对Sn0.3Ag0.7Cu焊膏性能的影响。结果表明:四氢糠醇和聚丙二醇对冰白和水白松香都具有较强的溶解性。当四氢糠醇和聚丙二醇以质量比9:1复配时,获得的焊膏平均铺展率可达87%以上,焊点完整、饱满、无焊球和桥连等缺陷,储存时间较长,是一种综合性能良好的焊膏。
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