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han jie bga zu zhuang he hui liu han cheng wei xing ye gong cheng shi zui ju tiao zhan xing de wen ti npl que xian zhen suo xiang ipc apex expo 2012 jin jun
Pages: I0018-I0018
Year: Issue:  2
Journal: Electronics Process Technology

Keyword:  组装工艺工艺缺陷APEXEXPOIPCNPL工程师回流焊;
Abstract: 350多个工程师参加了IPC网络研讨会,主题为焊接和组装缺陷。他们对印制电路板、PCB组件和PCB组装工艺失效中最让人头疼的问题进行了投票。结果表明焊接、球栅阵列封装(BGA)组装和回流焊是最大的挑战,同时为网络研讨会协办单位英国国家物理实验室(NPL)提供了有用的信息,帮助他们为2月28日至3月1日在圣地亚哥举行的IPC APEX EXPO 2012上的NPL工艺缺陷诊所做准备。
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