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A Review of Chip Scale Package Technology
Author(s): 
Pages: 418-421
Year: Issue:  6
Journal: MICROELECTRONICS

Keyword:  芯片尺寸封装电子封装技术微电子;
Abstract: 芯片尺寸封装 (CSP) 技术是近年来发展最为迅速的微电子封装新技术.文中介绍了该技术的基本概念、特点、主要类型及其应用现状和展望.
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