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Assembly Technology and Quality Control of BGA
Author(s): 
Pages: 34-37
Year: Issue:  1
Journal: Electronics Process Technology

Keyword:  BGAElectronic assemblyTemperature profileQuality controlInspection;
Abstract: BGA器件已越来越广泛地应用到电子产品中,并且随着μBGA和CSP的出现,组装难度越来越大,工艺要求也越来越高。主要分析了影响BGA组装质量的各个环节因素,从工艺控制、组装操作、管理和检测判定等四个方面详细阐述了控制质量关键点及实施要求。
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