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Effect Factors on Quality of Board Level Assembly
Author(s): 
Pages: 1-3
Year: Issue:  1
Journal: Electronics Process Technology

Keyword:  Quality of solder jointFailure of solder jointFailure analysisMetallographic analysisInterface;
Abstract: 组装工艺通常是板级产品最关键工艺,SMT将印制板和元器件通过SMT设备组装到一起。如果测试不通过,客户只归罪于最终的组装加工厂,其实影响板级产品质量的不光是组装加工,还有元器件质量、印制板质量以及加工工艺等。通过对一个案例的金相分析,介绍影响板级质量的多种因素和这些因素是如何影响产品质量的。
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