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Application of Muti-Diamond Wire Saw to Slice SiC Crystal
Pages: 50-52
Year: Issue:  1
Journal: Electronics Process Technology

Keyword:  金刚石线线切割SiCDiamond wireWire sawSilicon carbide;
Abstract: 介绍了金刚石多线切割设备的原理,并采用直径为250μm的金刚石线进行切割工艺实验。使用不同的工艺参数,比较了不同工艺参数对晶片TTV(整体厚度偏差)的影响,给出了实验比较结果,通过改变工艺参数可以使各切割片的TTV控制在25μm之内。
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