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feng zhuang ke yi cheng shou duo da de ying bian -ipc jedec-9707 de qiu mian wan qu ce shi neng gou jian shao ji xie shi xiao
Pages: I0010-I0010
Year: Issue:  1
Journal: Electronics Process Technology

Keyword:  球栅阵列封装定量测试方法机械失效弯曲特性球面应变电路组装机械应力;
Abstract: 在制造、搬运及印刷电路组装(PCA)测试等环节,封装都会受到大量的机械应力,从而引发失效。随着球栅阵列封装变得越来越大,针对这些工艺步骤应该如何设定安全值也变得越加困难。在IPC/JEDEC-9707《板级互联中的球面弯曲特性测试方法》中,新的定量测试方法让用户明确封装可以承受多大的应变而不会导致可靠性的下降。
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