The server is under maintenance between 08:00 to 12:00 (GMT+08:00), and please visit later.
We apologize for any inconvenience caused
Login  | Sign Up  |  Oriprobe Inc. Feed
China/Asia On Demand
Journal Articles
Laws/Policies/Regulations
Companies/Products
Bookmark and Share
Vision Positioning System of Flip Chip Bonder
Author(s): 
Pages: 41-44,59
Year: Issue:  1
Journal: Electronics Process Technology

Keyword:  Flip Chip technologyDual planes dual FOV optical systemComplex precision positioning platformImage aligning algorithm;
Abstract: 倒装焊技术被越来越多地应用于微波组件和光电子器件等高频和高速电子产品的生产制造中。介绍了倒装焊机的功能要求。重点分析了复合精密定位平台和双面双视场光学系统的设计原理和系统设计方案。通过建立设计模型,提出一种实用的图像对位算法,经应用验证,该算法能满足系统的对位精度要求。
Related Articles
No related articles found