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Issue:
Simulation of Interconnection and Package Effect in High-speed MCM
Author(s):
MAO Ji-feng
,
LI Zheng-fai
,
CAO Yi
,
XU Qin-wei
Pages:
130
-
132
Year:
2000
Issue:
5
Journal:
ACTA ELECTRONICA SINICA
Keyword:
兰召斯Pade逼近
;
微分求积法
;
部分元等效电路
;
渐近波形估值
;
Abstract:
本文针对高速MCM布线网中由互连和封装引起的寄生效应提出了进行计算机仿真的方法.此方法以兰召斯Pade逼近算法(PVL)为基础,综合了部分元等效电路的三维模型,微分求积法的互连线宏模型,求解包含通孔、多导体互连线和集总元件组成的复杂线网对高速脉冲信号的响应.为分析高速MCM设计中的电特性问题提供了高效的工具.
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