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A comparative study on migratory properties of copper in nickel, cobalt and palladium deposits
Author(s): 
Pages: 4-7
Year: Issue:  4
Journal: ELECTROPLATING & FINISHING

Keyword:  金属扩散防铜渗镀层电镀;
Abstract: 以镍、钴、钯镀层作为铜基体镀金的防渗铜中间层可以有效地防止铜原子扩散到金属表面.采用SEM、EDAX、XRD等方法研究铜在该3种金属内的扩散机理和扩散系数,探讨了扩散过程与这3种金属晶体结构、晶粒大小以及X-射线衍射特性的关系.
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