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Application of microelectronic plating
Author(s): 
Pages: 48-53,56
Year: Issue:  4
Journal: ELECTROPLATING & FINISHING

Keyword:  微电子镀覆半导体IC封装凸点多芯片组件微电子机械系统;
Abstract: 介绍了微电子镀覆在半导体和IC封装、凸点制作、多芯片组件以及微电子机械系统中的应用.
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