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Microstructure and Thermal Conductivity of Aluminium Nitride with (YCa)F3 as Sintering Aid
Author(s): LIU Yao-Cheng, ZHOU He-Ping, QIAO Liang
Pages: 619-
624
Year: 2000
Issue:
4
Journal: JOURNAL OF INORGANIC MATERIALS
Keyword: aluminium nitride; sintering; thermal conductivity; microstructure; SThM;
Abstract: Aluminium nitride ceramics were successfully fabricated through low-temperature sintering by using (YCa)F3 as the sintering aid. AlN ceramics with a high thermal conductivity of 208W/m were obtained after the specimen was sintered at 1650C for 6h. Calculation based on the present and reported results led to an equation which describes the dependence of thermal conductivity of AlN on the soaking time in sintering: (t)=-(0) et/. SEM, TEM, SThM and HREM were employed to study the microstructure-property relationship of AlN ceramics. It was concluded that AlN grain sizes have little effect on the thermal conductivity, while grain boundary phases deteriorate thermal conductivity
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