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Application and Study of Acoustic Micro Imaging
Author(s): 
Pages: 49-53
Year: Issue:  2
Journal: Electronic Product Reliability and Environmental Testing

Keyword:  超声显微成像片式多层瓷介电容器内部缺陷破坏性物理分析;
Abstract: 通过对超声显微成像技术(AMI)检测原理的分析,阐述了AMI在检测片式多层瓷介电容器(MLCC)裂纹、分层和空洞等内部缺陷方面的具体应用,其检测结果得到了破坏性物理分析(DPA)的验证.此外,还讨论了不同频率的超声波传感器对AMI检测结果的影响,对提高AMI检测结果的准确性具有指导意义.
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