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Issue:
Application and Study of Acoustic Micro Imaging
Author(s):
LIU Si-quan
Pages:
49
-
53
Year:
2011
Issue:
2
Journal:
Electronic Product Reliability and Environmental Testing
Keyword:
超声显微成像
;
片式多层瓷介电容器
;
内部缺陷
;
破坏性物理分析
;
Abstract:
通过对超声显微成像技术(AMI)检测原理的分析,阐述了AMI在检测片式多层瓷介电容器(MLCC)裂纹、分层和空洞等内部缺陷方面的具体应用,其检测结果得到了破坏性物理分析(DPA)的验证.此外,还讨论了不同频率的超声波传感器对AMI检测结果的影响,对提高AMI检测结果的准确性具有指导意义.
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