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Study on Ultra-precision Grinding of Single Silicon Brittle Material in the Ductile Mode
Author(s): 
Pages: 8-11
Year: Issue:  2
Journal: AVIATION PRECISION MANUFACTURING TECHNOLOGY

Keyword:  single silicon brittle materialultra-precision grindingdiamond wheelgrinding in the ductile mode;
Abstract: In this paper,the experimental investigation is made on the grinding of single brittle materials.It is shown that the surface roughness is mainly related with the average grain size and feed per wheel revolution for the brittle materials such as single silicon.In the case of Vs=1200m/min,f=0~500μm/rev,ap=0.1~10μm,only when the average grain size of the diamond wheel is less than 20μm,the smooth high quality surface with the roughness of rms=5.14nm,Ra=3.25nm can be obtained under the condition of grinding in the ductile mode.
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