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Analysis of tin plating failure in pattern plating
Author(s): 
Pages: 14-17
Year: Issue:  6
Journal: Electroplating & Finishing

Keyword:  印刷线路板图形电镀镀锡失效药水污染震动频率;
Abstract: 高厚径比线路板会产生高镀锡失效风险.本文针对镀锡失效问题进行分析,从药水各项指标的排查及设备关键控制点等方面入手,对原因进行准确定位.通过活性炭芯过滤、及时更换棉芯等改善措施,降低了药水的有机污染程度;同时,通过调整震动方向,提高了震动频率,改善了气泡的排出效果.通过进行可靠性试验和生产板量产评价,证实所采取的改善措施成效明显.
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