Discussion More about Copper-Phosphorus Anode in Bright Sulfate Copper Plating Process
Author(s): CHENG Liang, KUANG Shaolin, ZHOU Tengfang
Pages: 20-26
Year: 1999 Issue: 2
Journal: ELECTROPLATING & FINISHING
Keyword: 阳极磷铜; 0.035％～0.070％; 磷含量;
Abstract: 在装饰性和PCB电镀中,酸性光亮镀铜的阳极最佳含磷量为0.035%～0.070%,磷化铜(Cu3P)黑膜的生成对于阳极性能具有决定性的意义.
Pages: 20-26
Year: 1999 Issue: 2
Journal: ELECTROPLATING & FINISHING
Keyword: 阳极磷铜; 0.035％～0.070％; 磷含量;
Abstract: 在装饰性和PCB电镀中,酸性光亮镀铜的阳极最佳含磷量为0.035%～0.070%,磷化铜(Cu3P)黑膜的生成对于阳极性能具有决定性的意义.
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