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Evaluation of Bonding Strength between Thin Film and Substrate by a New Indentation Tester
Author(s): 
Pages: 13-20
Year: Issue:  2
Journal: Vacuum Science and Technology

Keyword:  压入法 涂层压入仪 涂层 结合强度;
Abstract: 用新颖的能连续加载、卸载并配有声发射监测的涂层压入仪 ,对薄膜与基体的结合强度进行了探讨。实验结果表明 ,膜或膜 /基破坏的声发射信号各有特点 ,可区分压入过程中 (含卸载 )开裂和剥落及其对应的载荷值。压入法的临界载荷 pc 为加载过程中使膜发生初始剥落的外载 ,用涂层压入仪可精确测定。 pc 值对基体硬度和表面粗糙度的变化敏感。故用涂层压入仪可以实现用压入法考察膜 /基结合强度
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