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The Applications of PPF Leadframe which be Used on Semiconductor Industry
Author(s): 
Pages: 36-39,43
Year: Issue:  3
Journal: Electronics and Packaging

Keyword:  RollS指令PPF框架绿色封装半导体工业;
Abstract: 随着半导体工业绿色封装的不断兴起,无铅化(Pb-free)也越来越成为业界的共识.为了彻底贯彻于2006年7月1日正式生效的欧盟RoHS指令,全球的电子OEM生产商,特别是那些目标客户是欧美和日本的生产商,必须具备完全的绿色产品生产能力.在国内集成电路生产领域,有的生产商尝试利用纯锡(Sn)来代替锡铅(SnPb)合金;还有一部分采用镍钯金(NiPdAu)以及希望利用锡铋合金(SnBi)或锡铜合金(...
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