Author(s): YIN Litao, REN Fengzhang, MA Zhanhong, SU Juanhua, TIAN Baohong, JIA Shuguo
Pages: 40-42,46
Year: 2010 Issue:  2
Journal: Electroplating & Finishing
Keyword:  copper; nickel; thin film; direct-current electro-deposition; in-situ bent-cathode method; intemal stress;
Abstract: 利用直流电沉积法,在碳素钢和铜基体上沉积Ni膜,以及在碳素钢基体上沉积Cu膜.用自行设计的原位弯曲阴极测量装置,测量了不同基体上不同薄膜的内应力.实验表明,原位弯曲阴极法比普通悬臂梁法更精确、简便.薄膜材料的内应力与基体材料有关.碳素钢基体和纯铜基体上沉积的Ni膜内应力随膜厚呈相反的变化趋势.碳素钢基体上电沉积Cu膜的内应力随膜厚的增加而降低;而碳素钢基体上电沉积Ni膜的内应力随膜厚的增加而增大,...