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Determination of lead in tin deposit on copper substrate
Author(s): 
Pages: 29-31
Year: Issue:  10
Journal: Electroplating & Finishing

Abstract: 在150℃下,先用50g/L的氢氧化钠溶液使铜基镀锡材料退镀,再用体积分数为10%的盐酸二次退镀,将两次退镀液分别定容到100 mL,稀释5倍后,用电感耦合等离子体质谱测定退镀液中的铅含量.此方法检出限为1 mg/kg,实际样品分析的相对标准偏差为2.7%,平均回收率为99.9%.该方法能满足欧盟RoHS指令以及食品接触材料中铅含量检测的要求.
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