The server is under maintenance between 08:00 to 12:00 (GMT+08:00), and please visit later.
We apologize for any inconvenience caused
Login  | Sign Up  |  Oriprobe Inc. Feed
China/Asia On Demand
Journal Articles
Laws/Policies/Regulations
Companies/Products
Bookmark and Share
Cause analysis of corrosion of electroplated electronic packages
Author(s): 
Pages: 16-19
Year: Issue:  9
Journal: Electroplating & Finishing

Abstract: 介绍了一次电子封装外壳镀层出现锈蚀故障的处理过程.该外壳基材为4J42铁绦合金,其上镀镍再镀金,短期搁置后发现锈蚀.通过锈蚀过程和机理的分析,并经过试验验证,确定了锈蚀的原因是:包装用塑料膜受到氯化物的污染,导致镍镀层和铁镍合金基材在贮存过程中发生腐蚀.在此基础上,制定了相应的质量控制措施.
Related Articles
No related articles found