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Pretreatment for electroplating of polyamide (PA) substrates
Author(s): 
Pages: 14-15
Year: Issue:  9
Journal: Electroplating & Finishing

Keyword:  尼龙电镀前处理装饰性镀层;
Abstract: 介绍了适用于尼龙(PA)基材的新型前处理工艺.经过膨胀、调校、钯活化、还原、化学镍(δ=0.3 μm)、预镀镍或铜(δ=2~5 μm),酸铜(δ=20 μm),光亮镍(δ=12 μm)、装饰铬(δ=0.3μm)等工艺后,可在尼龙表面获得结合力良好的装饰性镀层.该工艺为开发尼龙塑料在电镀业的应用迈出了重要的一步.
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