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Review of HEDP direct copper plating process on iron and steel workpiece after 30 years of development-Part Ⅰ. History and recent 30 years of improvement
Author(s): 
Pages: 7-9,19
Year: Issue:  9
Journal: Electroplating & Finishing

Keyword:  钢铁镀铜1-羟基乙叉-11-二膦酸配位剂;
Abstract: 本文分3部分刊出.第一部分回顾了国内钢铁件HEDP直接镀铜工艺的开发历程以及国内外HEDP无氰镀铜的工业应用状况.分析了HEDP、柠檬酸盐、焦磷酸盐和氰化物作为碱性镀铜配位剂的优缺点.结合近30年来的生产实践,认为HEDP还是目前碱性无氰镀铜的首选配位剂.
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