The server is under maintenance between 08:00 to 12:00 (GMT+08:00), and please visit later.
We apologize for any inconvenience caused
Login  | Sign Up  |  Oriprobe Inc. Feed
China/Asia On Demand
Journal Articles
Laws/Policies/Regulations
Companies/Products
Study on Pyrolysis Process and Joining Performance of Silicone Resin 805
Author(s): 
Pages: 73-75
Year: Issue:  2
Journal: NEW TECHNOLOGY & NEW PROCESS

Keyword:  硅树脂裂解陶瓷连接活性填料;
Abstract: 研究了硅树脂805的裂解过程,在此基础上采用硅树脂805高温连接氮化硅结合碳化硅陶瓷,研究了连接温度、连接压力以及活性填料对连接性能的影响.结果表明,在1 000~1 400 ℃范围内,随着温度的升高,硅树脂裂解产物发生了由非晶态向晶态的转变.采用单一硅树脂805为连接剂时,连接温度、连接压力对连接强度均有较大影响,当连接温度为1 200 ℃,连接压力为100 kPa时,连接试样抗弯强度达70.5 MPa.硅树脂中加入适量的活性填料-纳米Al粉可有效地提高连接强度,同时降低连接温度,连接温度为1 100 ℃所获连接试样抗弯强度达最大值102.6 MPa.微观结构分析显示,连接层结构较为均匀致密,连接层与母材间界面接合良好.
Related Articles
loading...