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Current Technology and Development of Vapour Preparation of Solder Powder in Surface Mount Technology
Author(s): 
Pages: 63-66,70
Year: Issue:  2
Journal: ELECTRONICS PROCESS TECHNOLOGY

Keyword:  表面组装焊锡膏焊锡粉雾化法;
Abstract: 焊锡粉是焊锡膏的主要成分,其质量的好坏对焊锡膏的印刷质量起着至关重要的作用.概述了焊锡粉的分类、性能及应用,并重点介绍了当前雾化法制备焊锡粉的技术与特点.结合制粉技术的发展,对球形焊锡粉新型制备技术进行了展望.
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