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Research of Effect of Cooling Rate on Lead- free Solder and Solder Joint Quality
Author(s): 
Pages: 71-73,77
Year: Issue:  2
Journal: ELECTRONICS PROCESS TECHNOLOGY

Keyword:  冷却速率无铅钎料焊点质量;
Abstract: 阐述了再流焊冷却速率对无铅钎料和焊点质量的影响的研究现状.已有的研究结果表明:冷却速率对于无铅钎料的微观组织、拉伸性能、金属间化合物的形态和尺寸以及焊点中的凝固缺陷等都有显著的影响.选择合适的冷却速率可以提高焊点质量.
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