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Automatic Management System of Solder Joint Reliability in Reflow Soldering
Author(s): 
Pages: 78-83
Year: Issue:  2
Journal: ELECTRONICS PROCESS TECHNOLOGY

Keyword:  加热因子焊点可靠性温度曲线金属间化合物自动再流焊管理系统;
Abstract: 加热因子Q是描述SMT再流焊过程的一个量化参数,决定了再流焊工艺以及焊点的可靠性,其大小直接反映了焊点的吸热量以及焊接界面形成的金属间化合物的形态.通过自动再流焊管理系统(ARM)对温度曲线进行监控和优化,调整加热因子,实现可靠的产品焊接.
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