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Study on the Processing Technology of the Step Designed Planar Buried Resistant Microwave Multilayer Printed Circuit Board
Author(s): 
Pages: 84-86,89
Year: Issue:  2
Journal: ELECTRONICS PROCESS TECHNOLOGY

Keyword:  平面埋电阻印制板工艺;
Abstract: 目前来说,通讯用陶瓷粉填充、玻璃短纤维增强的聚四氟乙烯微波多层印制电路板的制造技术越来越显现出其重要性,对平面电阻印制板的制造工艺流程进行了简单的介绍,对埋电阻台阶式多层微波印制板制造所采用的工艺技术进行了较为详细的论述.
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