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Design of Sintering Die for Metallic Packages
Author(s): 
Pages: 108-111
Year: Issue:  2
Journal: ELECTRONICS PROCESS TECHNOLOGY

Keyword:  金属封装外壳石墨模具定位设计;
Abstract: 金属封装外壳是一种新发展起来的技术,虽然起步较早,但是最近几年才得到飞速发展和大量应用,不同结构的封装外壳需要不同结构的石墨模具定位烧结,讨论了封装外壳烧结模具的基本设计思路和注意要点,并对特殊种类的烧结模具做了相应的描述.
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