The server is under maintenance between 08:00 to 12:00 (GMT+08:00), and please visit later.
We apologize for any inconvenience caused
Login
|
Sign Up
|
Oriprobe Inc.
|
Feed
Home
Journals
Order
TOC Alerts
Subscription
Products & Services
Pricing
FAQ
About
Journal Articles
Laws/Policies/Regulations
Companies/Products
Title, abstract, keywords:
Combined Search
Advanced Search
Pay per View through On Demand Search
Package:
ALL
Astro-Earth Science
Agriculture
Physics
Mathematics
Arts & Humanities
Medline Collection
Health/Medicine/Biology
Chemistry/Chemical Engineering
CAOD
English Journals
Traditional Chinese Medicine
NPC CPPCC Journals
China Defense and Military Sciences
Author:
Journal / Book Title:
Year:
Volume:
Issue:
Study of Sn-8Zn Lead-free Solder Weldability
Author(s):
SHANG Yan-geng
,
LANG Bo
,
SUN Da-qian
,
WU Wen-yun
,
HUANG Ze-wu
Pages:
197
-
200
Year:
2006
Issue:
4
Journal:
ELECTRONICS PROCESS TECHNOLOGY
Keyword:
无铅钎料
;
抗氧化性
;
剪切强度
;
热处理
;
Abstract:
研究了不同微量合金元素(Bi、Ag)对Sn-8Zn无铅钎料高温抗氧化性能及接头剪切强度的影响,采用氧化质量增加△m值的方法,在高温下观察钎料表面氧化膜形状和颜色的变化并对氧化膜进行X射线衍射分析,探讨了钎料的高温抗氧化性能的机理,通过对钎料的金相显微组织观察和对热处理后钎焊接头的剪切强度试验,分析了提高接头剪切强度的原因.试验结果表明:在Sn-8Zn钎料中加入适量的合金元素(Bi、Ag)均可以改善和提高钎料的高温抗氧化性能和接头的剪切强度.
Citations
Searching Exception
Related Articles
loading...