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Effects of solution heat treatment on microstructure in a high purity 7055 aluminum alloy
Author(s): 
Pages: 54-59
Year: Issue:  3
Journal: TRANSACTIONS OF MATERIALS AND HEAT TREATMENT

Keyword:  高纯7055铝合金固溶初生AlZnMgCu相再结晶;
Abstract: 采用光学显微镜(OM)、扫描电镜(SEM)和X射线衍射谱仪研究了固溶处理对高纯7055铝合金组织的影响.结果表明:合金固溶时,粗大的初生AlZnMgCu相溶解缓慢,并逐渐球化;而初生AlZnMgCuFeTi相几乎不溶解.固溶温度越高(460-480℃),时间越长(0-240min),初生AlZnMgCu相溶解越多,再结晶越多,晶粒尺寸越大.再结晶主要于初始晶界上的粗大初生相上形核(PSN机制),并向弥散Al3Zr粒子少的变形晶粒内部长大.490℃固溶时,出现过烧组织,晶粒粗大.分级固溶较单级固溶可更好的控制合金组织,如460℃×120min+480℃×60min与480℃×180min相比,再结晶和晶粒尺寸小得多,但初生AlZnMgCu相溶解程度相差不大.
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